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10th IEEE INTERNATIONAL TEST CONFERENCE INDIA
2026

JULY 19-21, 2026 | RADISSON BLU, MARATHAHALLI, BENGALURU

PROGRAM AGENDA

Day 0

Tutorials & Industry Test Challenge

Sunday, July 19, 2026

08:00 AM – 09:15 AM
Registrations
09:15 AM – 10:45 AM
Grand Victoria 1
CHAIRBharath Nandakumar

Squeezing Quality into Cents: DFT Strategies for Low-cost MCUs

Tutorial Track 1(a)
Vishal Diwan and Mudasir Kawoosa (Texas Instruments)
Grand Victoria 2
CHAIRRajit Karmakar

LLM for VLSI Design, Automation and Test

Tutorial Track 2(a)
Chandan Karfa (IIT Guwahati)
Arabica & Robusta
CHAIRRama Sireesha Arisetti

Mission Mode Scan Dump Using IJTAG and TAP Customization: Architecture, Implementation, and Practical Considerations

Tutorial Track 3(a)
Sreekanth G Pai and Raseena KA (Marvell)
Brain Box
CHAIRAbhishek Chaudhary

Testing Chiplet-Based 2.5D/3D ICs : An Academia/Industry perspective

Tutorial Track 4(a)
Binod Kumar, Manisha Kumari (IIT Jodhpur), Jaynarayan T Tudu (IIT Tirupati), Jyotirmoy Saikia and Sagar Kumar (Cadence)
10:45 AM – 11:15 AM
Tea/Coffee Break
11:15 AM – 12:45 PM
Grand Victoria 1
CHAIRBharath Nandakumar

Closed Loop Test Engineering – From Design to Mass Production

Maheedhar Jalasutram, Jeren Ku and Daejin Shin (Google)
Grand Victoria 2
CHAIRRajit Karmakar

Machine Learning is Inevitable or Not: A DFT Designer’s View

Ankush Srivastava (Qualcomm)
Arabica & Robusta
CHAIRRama Sireesha Arisetti

Beyond Scan Dump: Why IEEE P2929 Enables True Scan State Extraction

Andy Hughes (Siemens EDA)
Brain Box
CHAIRAbhishek Chaudhary

Testing Chiplet-Based 2.5D/3D ICs : An Academia/Industry perspective

Binod Kumar, Manisha Kumari (IIT Jodhpur), Jaynarayan T Tudu (IIT Tirupati), Jyotirmoy Saikia and Sagar Kumar (Cadence)
12:45 PM – 01:45 PM
Lunch Break
01:45 PM – 03:15 PM
Grand Victoria 1
CHAIRBharath Nandakumar

Testing to Self Testing: Self Test Driven Functional Safety for ISO 26262 Compliant Automotive SoCs

Tutorial Track 1(b)
Rajesh Kumar Tiwari and Mohammed Zuber P Malek (Qualcomm)
Grand Victoria 2
CHAIRRajit Karmakar

The Seamless Integration of Packetized Scan and In-system test with Advanced ATE Equipment

Tutorial Track 2(b)
Hagen Goller (Advantest)
Arabica & Robusta
CHAIRRama Sireesha Arisetti

Advanced Test Data Analytics for Yield and Quality Improvement

Tutorial Track 3(b)
Navya Rastogi, Shamitha Rao, Shrestha Hota (Synopsys)
Brain Box
CHAIRAbhishek Chaudhary

Industry Test Challenge

invite only session
Talk1
Talk2
Break
Talk3
Talk4
Break
Panel Discussion
Correlation Crisis in Semiconductor Test: Can AI Bridge the Gap? Moderator: Sameer Chillarige (Cadence) | Panelists: Udayakiran Yallamaraju (Qualcomm), John Schulze (AMD), C Jagadish Kumar (Intel), Raghu G G (Infineon)
03:15 PM – 03:45 PM
Tea/Coffee Break
Brain Box
CHAIRAbhishek Chaudhary

Industry Test Challenge

invite only session
Talk1
Talk2
Break
Talk3
Talk4
Break
Panel Discussion
Correlation Crisis in Semiconductor Test: Can AI Bridge the Gap? Moderator: Sameer Chillarige (Cadence) | Panelists: Udayakiran Yallamaraju (Qualcomm), John Schulze (AMD), C Jagadish Kumar (Intel), Raghu G G (Infineon)
03:45 PM – 05:15 PM
Grand Victoria 1
CHAIRBharath Nandakumar

Understanding Test Escapes and the Limitations of Scan DFT Testing

Adit Singh (Auburn university)
Grand Victoria 2
CHAIRRajit Karmakar

Scalable ATE Hardware Design: From Concept to Manufacturing with Reusable Architecture

Lokapriya B, Senthilkumar Dhamodharan and Dyaneswaran Anguraj (Caliber Interconnects)
Arabica & Robusta
CHAIRRama Sireesha Arisetti

Customer Centric Post Silicon Validation Approach for System on Chip (SoC)

Ravishankar Manishankar and Siloni Palani (Intel)
Brain Box
CHAIRAbhishek Chaudhary

Industry Test Challenge

invite only session
Talk1
Talk2
Break
Talk3
Talk4
Break
Panel Discussion
Correlation Crisis in Semiconductor Test: Can AI Bridge the Gap? Moderator: Sameer Chillarige (Cadence) | Panelists: Udayakiran Yallamaraju (Qualcomm), John Schulze (AMD), C Jagadish Kumar (Intel), Raghu G G (Infineon)
06:30 PM – 07:45 PM
Arabica & Robusta

TTTC Workshop