Call for Papers

Call For Submissions

Important Dates :

Regular Papers: (Firm deadline, no extensions are allowed further)

✓ Paper submission deadline : 17th April, 2023 – Closed
✓ Author notification : 11th June, 2023 – Closed
✓ Final manuscript due : 10th July, 2023

✓ Paper submission deadline :
03rd Apr, 2023
✓ Author notification :
08th May, 2023
✓ Final manuscript due :
05th June, 2023

Please note: Full length paper submission along with the abstract is allowed till submission deadline date.

Posters:

✓ Poster submission deadline : 01st June, 2023 – Closed
✓ Author notification : 18th June, 2023

✓ Poster submission deadline :
24th April, 2023
✓ Author notification :
22th May, 2023

Please note: We require the authors to follow this paper template: CFP template

The Call For Papers for ITC Conference 2023 is live!

International Test Conference is the world’s premier venue dedicated to the electronic test of devices, boards and systems—covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis and failure analysis, and back to process and design improvement. At ITC India, design, test, and yield professionals can confront challenges faced by the industry, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. This ITC India conference will be blend of virtual & direct participation focusing on Test development in India but the submissions may not be limited to topics related to this region. Topics related to design and test development across any geographical regions will be of interest.

Authors are invited to submit original, unpublished papers describing recent work in the field of test and design. In addition, authors are invited to submit high quality, practical, industry best practices. Submissions simultaneously under review or accepted by another conference, symposium or journal, will be summarily rejected. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Authors are also invited to submit a single-page poster proposal, double-columned in Format (template available in EasyChair). Posters are a useful way of presenting late-breaking results, getting feedback on an innovative method, or participating without having to write a full paper.

Note: For detailed information about the submission process, requirements and deadlines, the selection process and any other questions regarding the program itself or contact information, please consult the ITC India web site at http://www.itctestweekindia.org or email the program chair at [email protected]

Submission Guidelines

  • One or two topic(s) from the topic list, or a description of your topic.
  • An abstract of 35 words or less to be entered online.
  • An electronic copy of a complete paper up to 6 pages, double-columned in IEEE Format, A4 size (https://www.ieee.org/conferences/publishing/templates.html) to be submitted through EasyChair (https://easychair.org/my/conference?conf=itcindia2023). Submissions less than 4 pages are rarely accepted.
  • Your submission must not include information that serves to identify the authors of the manuscript, such as name(s) or affiliation(s) of the author(s), anywhere in the manuscript, abstract, or in the embedded PDF data. References and bibliographic citations to the author(s) own published works or affiliations should be made in the third person
Submit Paper
CFP Template
Poster submission
Poster submission
Poster Template
Poster submission

ITC India invites submissions on the latest advances in test, validation and diagnosis of ICs, boards and systems.

Topics of interest include (not limited to)

3D/2.5D Test

RF, mm-Wave and THz testing

Adaptive Test in Practice

ATE/Probe Card Design

Advances in Boundary Scan

Bring Up

Data Driven Methods

Data Exchange and Infrastructure

Defect-Oriented Testing

DFM and Test Diagnosis

Economics of Test

End-to-End Data Analysis

Embedded BIST & DFT

Emerging Defect Mechanisms

Hardware Security and Trust

IoT Testing

Known-Good-Die testing

Memory Test and Repair

MEMS Testing

Mixed-Signal and Analog Test

New Technologies and Test

On-Chip Test Compression

Online Test

Pre- and Post- Silicon Validation

Power Issues in Test

Protocol-aware Test

Reliability and Resilience

Scan Based Test

SoC/SiP/NoC Test

 

Silicon Debug

Jitter, High-Speed I/O and RF Test

Simulation and Test

System Test (Applications)

System Test (Hardware/Software)

Test-to-Design Feedback

Test Escape Analysis

Test Flow Optimizations

Test Generation and Validation

Test Resource Partitioning

Test Standards

Test Time Analysis and Reduction

Testing High Speed Optics/Photonics
Timing Test

Yield Analysis and Optimization

 

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